Review of Failures of Photovoltaic Modules

ID: src:iea-pvps-t13-01-2014
IRI: https://solarlattice.org/kb/src/iea-pvps-t13-01-2014
Status: active

Source

Publisher: IEA PVPS
Edition or date: IEA-PVPS T13-01:2014
Tier: reference
Licence: IEA PVPS terms of use
Text and data mining: yes
Collection: failure-modes
Origin: https://iea-pvps.org/wp-content/uploads/2020/01/IEA-PVPS_T13-01_2014_Review_of_Failures_of_Photovoltaic_Modules_Final.pdf
SHA-256: c9cf105ed52cf087e781c33fe6b58c8f452451e586278124ad39c515e129a328

Cited by

Anti-reflective coating c1
Cell interconnect ribbon c1
Cell interconnect ribbon c2
Solar cell c6
Crystalline silicon PV c4
PV module end of life c1
PV module end of life c3
PV module end of life c4
Thin-film PV c2
Thin-film PV c3
Thin-film PV c4
Thin-film PV c5
Thin-film PV c6
Thin-film PV c7
Arc fault c1
Arc fault c9
Arc fault c10
Arc fault c11
Cell Cracks c1
Cell Cracks c2
Cell Cracks c3
Cell Cracks c4
Cell Cracks c5
Cell Cracks c6
Cell Cracks c7
Cell Cracks c8
Cell Cracks c9
Cell Cracks c10
Cell Cracks c11
Cell Cracks c15
Cell Cracks c16
Cell Cracks c26
Cell Cracks c35
Delamination c2
Delamination c3
Delamination c4
Delamination c5
Delamination c7
Delamination c8
Delamination c9
Delamination c10
Delamination c13
Delamination c15
Delamination c18
Delamination c20
Delamination c22
Delamination c23
Delamination c24
Delamination c25
Discoloration c1
Discoloration c4
Discoloration c5
Discoloration c6
Discoloration c10
Discoloration c11
Discoloration c12
Discoloration c15
Discoloration c19
Discoloration c20
Glass Corrosion or Abrasion c9
Glass Corrosion or Abrasion c10
Glass Corrosion or Abrasion c11
Junction Box Failure c1
Junction Box Failure c2
Junction Box Failure c3
Junction Box Failure c4
Junction Box Failure c5
Junction Box Failure c17
Junction Box Failure c19
Junction Box Failure c24
Leakage current c3
Leakage current c4
Leakage current c5
Leakage current c8
Leakage current c10
Leakage current c13
Leakage current c14
Leakage current c15
Module Hotspot from Cell Damage c22
Dark metallization discoloration c1
Dark metallization discoloration c2
Crack pattern in EL image c1
Inactive cell area in EL c1
Lowered Isc on IV curve c1
Lowered Isc on IV curve c2
No test signal at ribbon c1
Power loss after stress test c3
Power loss after stress test c4
Power loss after stress test c5
Power loss after stress test c6
Power loss after stress test c7
Power loss after stress test c8
Power loss after stress test c9
Power loss after stress test c10
Uneven cell fluorescence c1
Infrared thermography c1
Infrared thermography c2
Infrared thermography c8
Junction box inspection c3
Junction box inspection c4
Junction box inspection c5
PID susceptibility lab test c1
Signal transmission method c1
Signal transmission method c2
Signal transmission method c3
Ultrasonic scanning c1
UV fluorescence imaging c1
UV fluorescence imaging c2
Visual inspection c1
Sodium ion migration c1
Transport damage c1
Transport damage c2
UV exposure c4
Burn marks c1
Burn marks c2
Clamp damage on module c1
Detached or open junction box c1
Dark lines in EL image c1
Dark regions in EL image c1
Dark regions in EL image c2
Encapsulant photobleaching c2
Fire damage c1
Distorted IV curve shape c1
Distorted IV curve shape c3
Distorted IV curve shape c4
Distorted IV curve shape c5
Distorted IV curve shape c6
Distorted IV curve shape c7
Distorted IV curve shape c8
Distorted IV curve shape c9
Low module open-circuit voltage c1
Low module open-circuit voltage c2
Low module open-circuit voltage c3
Low module open-circuit voltage c7
Snail tracks c1
Snail tracks c2
Snail tracks c3
Snail tracks c4
Snail tracks c5
Uneven cell heating c1
Uneven cell heating c2
Uneven cell heating c3
Uniformly heated cell c1
Warm cells near frame c1
Warm cells near frame c5

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