Solar Lattice

Measurement

Power loss after stress test

ID
meas:stress-test-power-loss
IRI
https://solarlattice.org/kb/meas/stress-test-power-loss
Status
active
Also known as
power degradation

This signature is a drop in module maximum power, usually measured by flash testing at standard test conditions before and after an accelerated stress test. In PID lab tests the module's rated system voltage is applied to its shorted leads while the module surfaces are grounded, either in a damp heat chamber or with foil or other conductive electrodes. Modules that lose more than the pass/fail limit in the 60°C, 85% RH PID test have also failed by potential induced degradation outdoors. In bifacial PERC modules, the PID-p loss is much larger when the module is flash tested from the rear than from the front. With longer stress, power can partly recover. Leakage current during the test is only a weak indicator of how much power is lost, so measure power directly. After damp heat or thermal cycling tests, EL images taken with the power measurement can show dark cell edges from corrosion or dark areas from disconnected busbars. Modules with more cracked cells, or with dendritic crack patterns, show more power loss after humidity freeze sequences.

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Claims

typical_power_loss

c1 verified · fact ≤ 10 PERCENT

Conditions: Bifacial glass/glass PERC modules with EVA after combined-accelerated stress testing with -1200 V bias, flash tested from the front at STC

Reported as almost 10% relative degradation, attributed to PID-p on the rear with a smaller LID contribution.

verified by: review-workflowverified on: 2026-10-20review note: possible conflict with c2 (same source; check the conditions); reviewer: the compiler-flagged conflict is a different scenario or source, not disagreement

c2 verified · fact ≥ 50 PERCENT

Conditions: Same combined-accelerated stress test of bifacial PERC glass/glass EVA modules at -1200 V, flash tested from the rear at STC

Loss looks much larger when the rear is illuminated during measurement.

verified by: review-workflowverified on: 2026-10-20review note: possible conflict with c1 (same source; check the conditions); reviewer: the compiler-flagged conflict is a different scenario or source, not disagreement

c3 disputed nominal 5 PERCENT

Conditions: One module design that survived a 96 h PID stress test at 60°C, 85% RH and -600 V

The 5% figure is also the pass/fail criterion. Modules losing more than that in this test failed by PID outdoors.

review note: possible conflict with c4 (same source; check the conditions); possible conflict with c5 (same source; check the conditions); possible conflict with c7 (same source; check the conditions); possible conflict with c8 (same source; check the conditions); possible conflict with c10 (same source; check the conditions)conflicts with: Power loss after stress test (c2)

c4 verified · fact ≤ 1.5 PERCENT

Conditions: Complete module shipping stacks after transport simulation per ASTM D4169/4728

verified by: review-workflowverified on: 2026-10-20review note: possible conflict with c3 (same source; check the conditions); possible conflict with c7 (same source; check the conditions); possible conflict with c8 (same source; check the conditions); possible conflict with c10 (same source; check the conditions); reviewer: the compiler-flagged conflict is a different scenario or source, not disagreement

c5 verified · fact ≤ 2.8 PERCENT

Conditions: Modules after transport simulation followed by thermal cycling and dynamic wind load tests

verified by: review-workflowverified on: 2026-10-20review note: possible conflict with c3 (same source; check the conditions); possible conflict with c7 (same source; check the conditions); possible conflict with c8 (same source; check the conditions); possible conflict with c10 (same source; check the conditions); reviewer: the compiler-flagged conflict is a different scenario or source, not disagreement

c6 verified · fact ≤ 5 PERCENT

Conditions: Seven of eight modules of one type after 2000 h damp heat at 85°C/85% RH

verified by: review-workflowverified on: 2026-10-20review note: support check: partial - Seven of eight modules showed less than 5% degradation after 2000 h damp heat, but the passage doesn't give 'up to 5%' as a maximum exactly; roughly consistent though 'less than 5%' vs 'up to 5%' is close; the figure also hints -7% for one module.; possible conflict with c8 (same source; check the conditions); reviewer: the compiler-flagged conflict is a different scenario or source, not disagreement

c7 disputed nominal 4 PERCENT

Conditions: One module after 2000 h damp heat at 85°C/85% RH

review note: possible conflict with c3 (same source; check the conditions); possible conflict with c4 (same source; check the conditions); possible conflict with c5 (same source; check the conditions); possible conflict with c8 (same source; check the conditions); possible conflict with c10 (same source; check the conditions)conflicts with: Power loss after stress test (c2)

c8 verified · fact nominal 28 PERCENT

Conditions: Same module after extending damp heat to 3000 h at 85°C/85% RH

Considered overstress. EL showed the outer cell parts completely dark from moisture-driven cell corrosion.

verified by: review-workflowverified on: 2026-10-20review note: possible conflict with c3 (same source; check the conditions); possible conflict with c4 (same source; check the conditions); possible conflict with c5 (same source; check the conditions); possible conflict with c6 (same source; check the conditions); possible conflict with c7 (same source; check the conditions); possible conflict with c9 (same source; check the conditions); possible conflict with c10 (same source; check the conditions); reviewer: the compiler-flagged conflict is a different scenario or source, not disagreement

c9 verified · fact ≤ 5 PERCENT

Conditions: Three of seven crystalline modules from different makers after 800 temperature cycles

verified by: review-workflowverified on: 2026-10-20review note: possible conflict with c8 (same source; check the conditions); reviewer: the compiler-flagged conflict is a different scenario or source, not disagreement

c10 verified · fact nominal 3 PERCENT

Conditions: Baseline (bias) loss from glass corrosion after mechanical load followed by 200 humidity freeze cycles

On top of this baseline, loss rises with the number of cracked cells.

verified by: review-workflowverified on: 2026-10-20review note: possible conflict with c3 (same source; check the conditions); possible conflict with c4 (same source; check the conditions); possible conflict with c5 (same source; check the conditions); possible conflict with c7 (same source; check the conditions); possible conflict with c8 (same source; check the conditions); reviewer: the compiler-flagged conflict is a different scenario or source, not disagreement

Referenced by

Data