Solar Lattice

Stressor

Moisture exposure

ID
stressor:moisture-exposure
IRI
https://solarlattice.org/kb/stressor/moisture-exposure
Status
active
Also known as
water ingress, moisture ingress, humidity ingress, moisture infiltration, Humidity

Moisture exposure means water or water vapour from the surroundings getting into modules, junction boxes and connectors. It is a key stressor that degrades PV modules. Inside the module, moisture breaks down EVA by hydrolysis, which releases acetic acid. The acid corrodes the silver gridlines and solder bonds, so series resistance rises and current collection drops. This is severe metallization corrosion. Moisture enters through the backsheet, along the module edges and at junction box penetrations. Even glass/glass modules do not keep it out completely. Delamination creates faster paths for water to get in and lets it condense, which speeds up corrosion. Water that gets into damaged or poorly sealed junction boxes corrodes the contacts. This can cause junction box failure, interconnection failure and insulation faults during humid periods. Humidity getting in through a defective or detached junction box also increases corrosion and weakens cell interconnections. This can lead to cell interconnection failure. In potential induced degradation (PID), corrosion caused by moisture getting in is the electrochemical mechanism, and it cannot be reversed. Salt mist in coastal areas has been reported to speed up PID. Exposure is higher on floating plants, in coastal areas and in humid climates. It is reduced by choosing module designs and installation practices that limit moisture, by sealing junction boxes properly and by finding out where the water is getting in.

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Claims

typical_power_loss

c1 verified · fact ≤ 80 PERCENT

Conditions: Worst case of corrosion caused by water ingress, observed in damp-heat tests

decrease the module maximum power by 80% in the worst-case during damp-heat tests

verified by: joshuahamsaverified on: 2026-10-20review note: support check: partial - Passage says power decreased by 80% in the worst case during damp-heat tests, but this is a worst-case bound, not a typical loss.

c2 verified · fact nominal 20 PERCENT

Conditions: Field-deployed EFG-Si module, first 3 years in the field; loss attributed to delamination, moisture ingress and corrosion of the electrical contacts

The source says Pmax fell by nearly 20% while Isc fell by about 5%.

verified by: joshuahamsaverified on: 2026-10-20

Referenced by

Data