Scanning acoustic microscopy is a non-destructive test for finding internal defects in PV modules, including delamination. It shows both whether delamination and voids are present inside the module and where they are. Delamination can form at any interface in the laminate, for example glass to encapsulant, cell to encapsulant, ribbon to encapsulant, or between backsheet layers. Pulse thermography can also find delamination without damaging the module, but acoustic microscopy resolves small defects better. Finding delamination early matters because it lets moisture in faster, which speeds up corrosion and causes current mismatch and power loss.
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producesc1 verified · fact Acoustic delamination or void map
SAM shows whether delamination and voids are present inside the module and where they are. It resolves small defects better than pulse thermography.
sec=2.3.2 h=5147bca98d09verified by: review-workflowverified on: 2026-10-20
detected_by c21